Phase stability in binary Ti-Al

Abstract

Binary Ti-Al samples containing from 46 to 54 at. pct Al were solidified while undercooled by various amounts using electromagnetic levitation techniques. A detailed thermal history of these samples was obtained with sampling rates as high as 500 KHz during recalescence. This very high sampling rate was essential to resolve the thermal events. Primary alpha solidification was observed in samples containing from 51 to 54 at. pct Al that were undercooled less than about 100 K at solidification. Primary beta solidification was found for all undercoolings tested in samples containing less than 51 at. pct Al and for undercoolings greater than about 100 K in samples containing 51 to 54 at. pct Al.