Numerical solutions for heat flow in adhesive lap joints

Abstract

The present formulation for the modeling of heat transfer in thin, adhesively bonded lap joints precludes difficulties associated with large aspect ratio grids required by standard FEM formulations. This quasi-static formulation also reduces the problem dimensionality (by one), thereby minimizing computational requirements. The solutions obtained are found to be in good agreement with both analytical solutions and solutions from standard FEM programs. The approach is noted to yield a more accurate representation of heat-flux changes between layers due to a disbond.