NASA NTRS · 19930049161
High density packaging and interconnect of massively parallel image processors
Abstract
This paper presents conceptual designs for high density packaging of parallel processing systems. The systems fall into two categories: global memory systems where many processors are packaged into a stack, and distributed memory systems where a single processor and many memory chips are packaged into a stack. Thermal behavior and performance are discussed.
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Carson, John C., Indin, Ronald J.. 1991-01-01. High density packaging and interconnect of massively parallel image processors. https://ntrs.nasa.gov/citations/19930049161
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