Nondestructive analysis and development

Abstract

This final report summarizes the achievements of project #4 of the NASA/UCF Cooperative Agreement from January 1990 to December 1992. The objectives of this project are to review NASA's NDE program at Kennedy Space Center (KSC) and recommend means for enhancing the present testing capabilities through the use of improved or new technologies. During the period of the project, extensive development of a reliable nondestructive, non-contact vibration technique to determine and quantify the bond condition of the thermal protection system (TPS) tiles of the Space Shuttle Orbiter was undertaken. Experimental modal analysis (EMA) is used as a non-destructive technique for the evaluation of Space Shuttle thermal protection system (TPS) tile bond integrity. Finite element (FE) models for tile systems were developed and were used to generate their vibration characteristics (i.e. natural frequencies and mode shapes). Various TPS tile assembly configurations as well as different bond conditions were analyzed. Results of finite element analyses demonstrated a drop in natural frequencies and a change in mode shapes which correlate with both size and location of disbond. Results of experimental testing of tile panels correlated with FE results and demonstrated the feasibility of EMA as a viable technique for tile bond verification. Finally, testing performed on the Space Shuttle Columbia using a laser doppler velocimeter demonstrated the application of EMA, when combined with FE modeling, as a non-contact, non-destructive bond evaluation technique.