Three-D Artificial Neural Network (3DANN) technology. Blueprint for the future

Abstract

Irvine Sensors Corporation (ISC), working closely with JPL under BMDO/ONR sponsorship, is developing a radically new neural computing technology. Primarily aimed at discrimination and target recognition for BMDO missile interceptor applications, it appears to have near term commercial applicability to such problems as handwriting and face recognition, just to name two. In its earliest form it will be able to perform inner product computation using 262 thousand 64x64 templates (weighted synapse arrays) where the 64(exp 5) weights can all be changed every millisecond. Internal switching provides an inherent capability to zoom, translate, or rotate the templates. The 3D silicon architecture is manufactured on a commercial, high volume DRAM production line at very low cost, enabling its commercialization. Two technology thrusts are beginning: in the first, the 64 layer capability of 3DANN-I will be extended to 1024 layers and beyond. In the second layer size will be shrunk to 2-3 millimeters to reduce layer costs. Our workshop goal is to expose this technology to the neural network community as an emerging tool for their use and to obtain their desire for its future development.