NASA NTRS · 20000063496
Advanced Interconnect Roadmap for Space Applications
Abstract
This paper presents the NASA electronic parts and packaging program for space applications. The topics include: 1) Forecasts; 2) Technology Challenges; 3) Research Directions; 4) Research Directions for Chip on Board (COB); 5) Research Directions for HDPs: Multichip Modules (MCMs); 6) Research Directions for Microelectromechanical systems (MEMS); 7) Research Directions for Photonics; and 8) Research Directions for Materials. This paper is presented in viewgraph form.
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Galbraith, Lissa. 1999-05-01. Advanced Interconnect Roadmap for Space Applications. https://ntrs.nasa.gov/citations/20000063496
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