Flexible Circuits

Abstract

Adflex Solutions, Inc.'s flexible circuits may be molded to the shape of a chassis for bulk reduction. Particularly valuable when circuitry must be moved. They are produced by combining a plastic film, a metallic conductor and an adhesive. One adhesive, LARC-TPI, developed by the Langley Research Center, is a thermoplastic polyimide resin used to produce laminates by Rogers Corporation. It can be processed at a lower temperature, has good moisture resistance and excellent adherence. It is used to bond film to copper foil conductor materials in flexible circuits. The circuits have both aerospace and commercial applications.