Thermal Design, Analysis, and Testing of the Quench Module Insert Bread Board

Abstract

Contents include the following: Quench Module Insert (QMI) science requirements. QMI interfaces. QMI design layout. QMI thermal analysis and design methodology. QMI bread board testing and instrumentation approach. QMI thermal probe design parameters. Design features for gradient measurement. Design features for heated zone measurements. Thermal gradient analysis results. Heated zone analysis results. Bread board thermal probe layout. QMI bread board correlation and performance. Summary and conclusions.