Single Axis Piezoceramic Gimbal

Abstract

This paper describes the fabrication, testing, and analysis of a single axis piezoceramic gimbal. The fabrication process consists of pre-stressing a piezoceramic wafer using a high-temperature thermoplastic polyimide and a metal foil. The differential thermal expansion between the ceramic and metal induces a curvature. The pre-stressed, curved piezoceramic is mounted on a support mechanism and a mirror is attached to the piezoceramic. A plot of gimbal angle versus applied voltage to the piezoceramic is presented. A finite element analysis of the piezoceramic gimbal is described. The predicted gimbal angle versus applied voltage is compared to experimental results.