Lifetime Reliability Prediction of Ceramic Structures Under Transient Thermomechanical Loads

Abstract

An analytical methodology is developed to predict the probability of survival (reliability) of ceramic components subjected to harsh thermomechanical loads that can vary with time (transient reliability analysis). This capability enables more accurate prediction of ceramic component integrity against fracture in situations such as turbine startup and shutdown, operational vibrations, atmospheric reentry, or other rapid heating or cooling situations (thermal shock). The transient reliability analysis methodology developed herein incorporates the following features: fast-fracture transient analysis (reliability analysis without slow crack growth, SCG); transient analysis with SCG (reliability analysis with time-dependent damage due to SCG); a computationally efficient algorithm to compute the reliability for components subjected to repeated transient loading (block loading); cyclic fatigue modeling using a combined SCG and Walker fatigue law; proof testing for transient loads; and Weibull and fatigue parameters that are allowed to vary with temperature or time. Component-to-component variation in strength (stochastic strength response) is accounted for with the Weibull distribution, and either the principle of independent action or the Batdorf theory is used to predict the effect of multiaxial stresses on reliability. The reliability analysis can be performed either as a function of the component surface (for surface-distributed flaws) or component volume (for volume-distributed flaws). The transient reliability analysis capability has been added to the NASA CARES/ Life (Ceramic Analysis and Reliability Evaluation of Structures/Life) code. CARES/Life was also updated to interface with commercially available finite element analysis software, such as ANSYS, when used to model the effects of transient load histories. Examples are provided to demonstrate the features of the methodology as implemented in the CARES/Life program.