Development and Ground-Test Validation of Fiber Optic Sensor Attachment Techniques for Hot Structures Applications

Abstract

Fiber Optic Strain Measurements: a) Successfully attached silica fiber optic sensors to both metallics and composites; b) Accomplished valid EFPI strain measurements to 1850 F; c) Successfully attached EFPI sensors to large scale hot-structures; and d) Attached and thermally validated FBG bond and epsilon(sub app). Future Development a) Improve characterization of sensors on C-C and C-SiC substrates; b) Apply application to other composites such as SiC-SiC; c) Assist development of interferometer based Sapphire sensor currently being conducted under a Phase II SBIR; and d) Complete combined thermal/mechanical testing of FBG on composite substrates in controlled laboratory environment.