NASA NTRS · 20060033565
Dimpled Ball Grid Array process development for space flight applications
Abstract
The 472 Dimpled Ball Grid Array (D-BGA) package has not been used in past space flight environments, therefore it is necessary to determine the robustness and reliability of the solder joints. The 472 D-BGA packages passed the above environmental tests within the specifications and are now qualified for use on space flight electronics.
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Barr, S. L., Mehta, A.. 2000-10-19. Dimpled Ball Grid Array process development for space flight applications. https://ntrs.nasa.gov/citations/20060033565
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