NASA NTRS · 20060034378
Design for Testability in 3-Dimensional Assemblies
Abstract
3DANN, a 3D mixed-mode multiple IC stacked processor capable of 1 TeraOPS, presented many novel problems related to testability.
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Villalpando, C., Lung, G.. 1999-10-20. Design for Testability in 3-Dimensional Assemblies. https://ntrs.nasa.gov/citations/20060034378
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