NASA NTRS · 20060034830
Test Strategies for NASAs 3-D Stack Multichip Module Space Flight Computer
Abstract
Advanced packaging technologies such as 3D chip stacking, multichip modules (MCMs), and 3D stacks of MCMs provide opportunities for significant reductions in system mass, volume and power.
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Sasidhar, K., Alkalai, L., Chatterjee, A.. 1998-07-09. Test Strategies for NASAs 3-D Stack Multichip Module Space Flight Computer. https://ntrs.nasa.gov/citations/20060034830
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