NASA NTRS · 20060036056
Probabilistic Fatigue Life Analysis of High Density Electronics Packaging
Abstract
The fatigue of thin film metal interconnections in high density electronics packaging subjected to thermal cycling has been evaluated using a probabilistic fracture mechanics methodology. This probabilistic methodology includes characterization of thin film stress using an experimentally calibrated finite element model and simulation of flaw growth in the thin films using a stochastic crack growth model.
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Moore, N. R., Kolawa, E. A., Sutharshana, S., Newlin, L. E., Creager, M.. 1996-08-07. Probabilistic Fatigue Life Analysis of High Density Electronics Packaging. https://ntrs.nasa.gov/citations/20060036056
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