NASA NTRS · 20060036795
Reliability Investigation of Ball Grid Array Assemblies for Space Flight Applications
Abstract
JPL, in a partnership with an industrial consortium, is currently engaged in the investigation of reliability and quality issues if ball grid array (BGA) packages as they may be applied to space flight electronics. Performing tests to determine the solder joint reliability of assemblies using BGAs under temperature cycling has proved to be a real challenge for test engineers.
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Bonner, D. K., Walton, S.. 1997-02-23. Reliability Investigation of Ball Grid Array Assemblies for Space Flight Applications. https://ntrs.nasa.gov/citations/20060036795
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