Design and Process Considerations for a Tunneling Tip Accelerometer

Abstract

In this paper, we discuss issues related to the fabrication of a bulk micromachined single axis accelerometer. The accelerometer is designed to have a full scale range of ten millig and a sensitivity of tens of nanog. During the process, three distinctly different die are fabricated. These are subsequently assembled using an ally bonding technique. During the bonding operation, electrical contacts are made between layers. The accelerometer is controlled by electrostatic force plates above and below the proof mass. The lower electrode has a dual role. In operation, it provides a necessary control electrode. When not in operation, it is used to clamp the proof mass and prevents its motion. Results of the fabrication process and initial testing of the clamping function are reported.