NASA NTRS · 20060044234
Lead free 0201 assembly and thermal cycle/aging reliability
Abstract
The many challenges with 0201 passive component assembly can be attributed to the solder paste volume, pad design, aperture design, board finish, type of solder paste, pick-and-place, and reflow profile. A Design-of-Experiment (DOE) study was carried out to investigate the effects of these parameters on assembly defects and reliability.
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Ghaffarian, Reza, Ramkumar, S. Manian, Varanasi, Arun. 2005-02-08. Lead free 0201 assembly and thermal cycle/aging reliability. https://ntrs.nasa.gov/citations/20060044234
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