NASA NTRS · 20080004431
Module comprising IC memory stack dedicated to and structurally combined with an IC microprocessor chip
Abstract
A computer module is disclosed in which a stack of glued together IC memory chips is structurally integrated with a microprocessor chip. The memory provided by the stack is dedicated to the microprocessor chip. The microprocessor and its memory stack may be connected either by glue and/or by solder bumps. The solder bumps can perform three functions--electrical interconnection, mechanical connection, and heat transfer. The electrical connections in some versions are provided by wire bonding.
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Carson, John C., Indin, Ronald J., Shanken, Stuart N.. 1994-09-13. Module comprising IC memory stack dedicated to and structurally combined with an IC microprocessor chip. https://ntrs.nasa.gov/citations/20080004431
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