NASA NTRS · 20080004460
Physically separating printed circuit boards with a resilient, conductive contact
Abstract
A multi-board module provides high density electronic packaging in which multiple printed circuit boards are stacked. Electrical power, or signals, are conducted between the boards through a resilient contact. One end of the contact is located at a via in the lower circuit board and soldered to a pad near the via. The top surface of the contact rests against a via of the facing printed circuit board.
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Baker, John D., Montalvo, Alberto. 1999-12-07. Physically separating printed circuit boards with a resilient, conductive contact. https://ntrs.nasa.gov/citations/20080004460
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