NASA NTRS · 20080017496
A Comparative Study of Inspection Techniques for Array Packages
Abstract
This viewgraph presentation reviews the inspection techniques for Column Grid Array (CGA) packages. The CGA is a method of chip scale packaging using high temperature solder columns to attach part to board. It is becoming more popular over other techniques (i.e. quad flat pack (QFP) or ball grid array (BGA)). However there are environmental stresses and workmanship challenges that require good inspection techniques for these packages.
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Mohammed, Jelila, Green, Christopher. 2008-04-28. A Comparative Study of Inspection Techniques for Array Packages. https://ntrs.nasa.gov/citations/20080017496
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