NASA NTRS · 20100015703
Packaging Concerns and Techniques for Large Devices: Challenges for Complex Electronics
Abstract
NASA is going to have to accept the use of non-hermetic packages for complex devices. There are a large number of packaging options available. Space application subjects the packages to stresses that they were probably not designed for (vacuum for instance). NASA has to find a way of having assurance in the integrity of the packages. There are manufacturers interested in qualifying non-hermetic packages to MIL-PRF-38535 Class V. Government space users are agreed that Class V should be for hermetic packages only. NASA is working on a new Class for non-hermetic packages for M38535 Appendix B, "Class Y". Testing for package integrity will be required but can be package specific as described by a Package Integrity Test Plan. The plan is developed by the manufacturer and approved by DSCC and government space.
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LaBel, Kenneth A., Sampson, Michael J.. 2010-02-09. Packaging Concerns and Techniques for Large Devices: Challenges for Complex Electronics. https://ntrs.nasa.gov/citations/20100015703
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