Nanoengineered Thermal Materials Based on Carbon Nanotube Array Composites

Abstract

State-of-the-art integrated circuits (ICs) for microprocessors routinely dissipate power densities on the order of 50 W/cm2. This large power is due to the localized heating of ICs operating at high frequencies and must be managed for future high-frequency microelectronic applications. As the size of components and devices for ICs and other appliances becomes smaller, it becomes more difficult to provide heat dissipation and transport for such components and devices. A thermal conductor for a macro-sized thermal conductor is generally inadequate for use with a microsized component or device, in part due to scaling problems. A method has been developed for providing for thermal conduction using an array of carbon nanotubes (CNTs). An array of vertically oriented CNTs is grown on a substrate having high thermal conductivity, and interstitial regions between adjacent CNTs in the array are partly or wholly filled with a filler material having a high thermal conductivity so that at least one end of each CNT is exposed. The exposed end of each CNT is pressed against a surface of an object from which heat is to be removed. The CNT-filler-composite adjacent to the substrate provides improved mechanical strength to anchor CNTs in place, and also serves as a heat spreader to improve diffusion of heat flux from the smaller volume (CNTs) to a larger heat sink.