NASA NTRS · 20160008419
Low-Melt Poly(Amic Acids) and Polyimides and Their Uses
Abstract
Provided are low-melt polyimides and poly(amic acids) (PAAs) for use as adhesives, and methods of using the materials for attaching two substrates. The methods typically form an adhesive bond that is hermetically sealed to both substrates. Additionally, the method typically forms a cross-linked bonding material that is flexible.
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Jolley, Scott T., Gibson, Tracy L., Williams, Martha K., Parrish, Clyde F., Snyder, Sarah J.. 2016-06-14. Low-Melt Poly(Amic Acids) and Polyimides and Their Uses. https://ntrs.nasa.gov/citations/20160008419
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