Virtex-5 CN Package Daisy Chain Evaluation Test Report

Abstract

The board-level temperature cycling reliability of Xilinx Virtex-5 (V5) CN package was investigated. V5s were temperature cycled under two conditions, 0 to +100 C (0/100) and -55 to +100 C (-55/100). During the 0/100 test, no part out of 8 parts failed up to 6586 cycles. During the -55/100 test, one part out of 8 parts failed at 1236 cycle, and there were no additional failures up to 1705 cycles. The failure mode of the part that failed at 1236 cycles indicated that most likely the failure was not a solder fatigue failure, and therefore no obvious solder fatigue failure was observed throughout the tests.