Sizing and Margin Methodology for Dual-Layer Thermal Protection Systems

Abstract

This presentation introduces a new sizing and margin methodology for dual-layer Thermal Protection Systems (TPS). The methodology has been tailored for application to a dual-layer 3D-woven TPS called Heat-shield for Extreme Entry Environments Technology (HEEET). Sizing is performed for a reference Saturn probe mission to show how uncertainties in trajectory, aerothermal modelling and TPS response impact the sizing of each layer.