NASA NTRS · 20210004766
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Niu, G., Li, Y., Cressler, J., Patel, J.. 2001-02-01. Electronics for extreme environments. https://ntrs.nasa.gov/citations/20210004766
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This project is a follow-on effort to the Joint Council on Aging AircraftJoint Group on Pollution Prevention (JCAAJG-PP) Pb-free Solder Project and NASA-DoD Lead-Free Electronics Project which were the first projects to test the reliability of Pb-free solder joints against the requirements of the aerospace and military community. This effort would continue to build on the results from the JCAAJG-PP Lead-Free Solder Project and NASA-DoD Lead-Free Electronics Project while focusing on a particular failure mechanism currently plaguing Pb-free assemblies, pad cratering.The NASA-DoD Lead-Free Electronics Project confirmed that pad cratering is one of the dominant failure modes that occur in various board level reliability tests, especially under dynamic loading. Pad Cratering is a latent defect that may occur during assembly, rework, and post assembly handling and testing.
In this paper, the technology development and infusion of the motor drive electronics assembly, along with the technology qualification and space qualification, is described and detailed. The process is an example of the qualification methodology for extreme environmen
Included in this talk: "Silicon-Germanium as an Enabling Technology for Extreme Environment Electronics" and "Ultra Low Power Mixed-Signal Design Challenges for Moon"