NASA NTRS · 20220014017
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Hari Rajgopal. Microengineering for Space Exploration: Recent work at NASA Glenn. https://ntrs.nasa.gov/citations/20220014017
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During research and development for NASA’s X-57 Maxwell all-electric aircraft project, the efficiency and power density requirements of its electric propulsion subsystem components were met, but aspects of integrating its powertrain subsystems proved problematic. Electromagnetic interference (EMI) from the cruise motor controller (CMC) was a significant challenge for the project. This problem was exacerbated by the lack of EMI requirements imposed on subsystem powertrain components. This report presents the results of EMI testing of the X-57 high lift motor controller (HLMC) at the NASA Glenn Research Center’s EMI Laboratory. For reference, the conducted emissions are compared to DO–160G and MIL–STD–61G conducted emissions limits. After the EMI test, mitigation of the conducted emissions using lightweight EMI chokes produced at NASA Glenn was evaluated using the Fast Fourier Transform (FFT) capability of an oscilloscope in the hardware development laboratory. This process can contribute to the rapid prototyping of electric powertrain components and EMI filters and improve the likelihood of successful EMI qualification at the component and system levels.
How to layout 500 °C durable integrated circuit cells for fabrication by NASA Glenn.
In order to fully utilize silicon carbide-based ceramics and ceramic matrix composites (CMCs) for aerospace and ground based applications, advanced joining and integration technologies are critically needed for achieving large, complex shaped, and integrated components. Careful material selection of joining inter-layers needs to consider chemical and thermal compatibilities with the parent materials that are being joined. Also, optimization needs to be conducted to select the proper processing conditions for achieving robust joints that are well adhered, strong, uniform, crack free, and have minimal residual stresses. NASA GRC developed pressureless and pressure aided approaches for joining ceramics and CMCs include brazing, diffusion bonding, refractory eutectic phase joining, and Single-step Elevated Temperature (SET) Joining. For joining ceramics and CMCs to metals, several brazes have been utilized. Brazing approaches for joining ceramics and metals have also included tailored brazes with multiple interlayers and particle additions. An overview of the joining approaches will be provided. In addition, processing-microstructure-property relationships will be discussed.