Thermally Conductive Melt-Processable Polyimide HBN Micro-Composites for High Temperature Electrical Insulation Applications

Abstract

Thermoplastic polymers exhibit excellent dielectric properties and manufacturing robustness. These properties mark thermoplastics as competitive material candidates for electrical insulation applications. However, the high-temperature performance of most thermoplastics is insufficient to meet the electrical wiring requirements for next-generation air and space transportation engineering designs, with continuous operation temperature requirements of up to 200 °C among other design requirements. Furthermore, the low thermal conductivity (κ) of polymers as a material class leads to heat trapping within wires which can amplify thermal stresses. As a result, there is a need to investigate candidate thermoplastic systems for their high temperature, dielectric, and κ performance.