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NASA NTRS · 20260008001

Development and Validation of a High-Vacuum Thermal Conductivity Testbed for Aerospace Interface Materials

Amy Chang·Deborah Hernandez
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Abstract

Spacecraft thermal margins depend on the temperature penalty of installed interfaces, yet catalog conductivity omits bondline thickness, mating surfaces, preload, and environment. The Testbed for Advanced Interface Materials in Vacuum (TAIMV) addresses this engineering-data gap by converting ambient/vacuum temperature fields from a four-coupon stack into quantities usable in spacecraft thermal models. Its 17-node steady-state model resolves axial conduction, parasitic fixture paths, grease-filled contact, radiation, and ambient convection. Four monolithic checks gave axial heat-rate ratios of 0.90–1.02, and Braycote calibration self-recovery gave 2.20% casewise mean absolute percentage error (MAPE) and 2.85% maximum difference. With transferable fixture terms frozen, Krytox LVP tested cross-material transfer against a manufacturer-derived external relation. The six Krytox cases gave 2.28% MAPE, 5.10% maximum difference, and full-field residual root-mean-square values of 0.553 °C ambient and 1.306 °C vacuum. Installed-joint resistance spanned 6.39–7.15 × 10⁻⁴ m²·K/W for Braycote and 4.09–4.49 × 10⁻⁴ m²·K/W for Krytox, corresponding to 2.33–6.66 K per modeled interface over the tested heat-flux range. TAIMV therefore supplies directly usable installed-joint resistance and conductance, plus apparent installed conductivity and explicitly model-conditioned grease conductivity/contact terms.

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Amy Chang, Deborah Hernandez. Development and Validation of a High-Vacuum Thermal Conductivity Testbed for Aerospace Interface Materials. https://ntrs.nasa.gov/citations/20260008001

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NASA NTRS2026

Development and Validation of a High-Vacuum Thermal Conductivity Testbed for Aerospace Interface Materials

Thermal Interface Materials (TIMs) are critical components in spacecraft thermal management systems, where thermal performance is strongly influenced by vacuum conditions, interface contact resistance, and layered metallic joint behavior. However, manufacturer-reported thermal conductivity values are often derived under idealized conditions and may not accurately represent performance within operational aerospace applications. To address this limitation, the Testbed for Advanced Interface Materials in Vacuum (TAIMV) was developed as a modular vacuum-compatible thermal conductivity characterization platform capable of evaluating aerospace-relevant TIM configurations under both ambient and high-vacuum environments. The testbed was derived from the ASTM C1044-16 guarded hot plate methodology and incorporates interchangeable layers of stainless steel coupon geometries, independently controlled main and guard heaters, embedded resistance temperature detectors (RTDs), thermocouples, multi-layer insulation (MLI), and a temperature-controlled cold plate to characterize through-thickness thermal gradients across layered interfaces. In the current configuration, interface compression is limited to the nominal contact pressure generated by the experimental stack assembly. Initial experimental campaigns were conducted at ambient pressure and below 1×10-5 torr for vacuum cases using multiple interface materials including Braycote 601EF and Krytox-based greases across a range of thermal operating conditions. In parallel, a coupled numerical Python thermal model was developed to predict temperature distribution throughout the stack while accounting for conduction, radiation, and parasitic heat transfer pathways and effective interface resistance effects. Experimental measurements and numerical predictions showed consistent thermal trends across multiple operating conditions and environmental states. Results also revealed measurable differences between ambient and vacuum thermal behavior, demonstrating the importance of interface resistance, parasitic heat transfer mechanisms, and stack geometry in determining effective thermal performance within layered thermal interfaces. The presented work establishes a foundation for future thermal model correlation efforts and expanded characterization of aerospace thermal interface materials under representative environmental conditions. Future work will focus on the integration of a load cell system to enable controlled pressure-dependent characterization of thermal interface materials under compressive loading. This capability will allow investigation of the influence of contact pressure on effective thermal conductivity, interface resistance, and thermal performance within layered aerospace thermal interfaces under representative operational conditions.

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