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DOE OSTI · 1018591

250 degrees C SiC High Density Power Module Development

Ning, Puqi·Wang, Fei·Ngo, Khai
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Abstract

Taking full advantage of SiC devices, a team from Oak Ridge National Laboratory, the University of Tennessee and Virginia Polytechnic Institute and State University have designed, developed, and tested a phase-leg power module based on a high temperature wirebond package. Details of the layout, gate drive, and cooling system designs are described. Continuous power tests confirmed that our design process produced a high density power module that operated successfully at high junction temperatures.

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BibTeXRIS

Ning, Puqi, Wang, Fei, Ngo, Khai. 2011-01-01. 250 degrees C SiC High Density Power Module Development. https://www.osti.gov/biblio/1018591

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