DOE OSTI · 1068864
Sealed substrate carrier for electroplating
Abstract
One embodiment relates to a substrate carrier for use in electroplating a plurality of substrates. The substrate carrier includes a non-conductive carrier body on which the substrates are held, and conductive lines are embedded within the carrier body. A conductive bus bar is embedded into a top side of the carrier body and is conductively coupled to the conductive lines. A thermoplastic overmold covers a portion of the bus bar, and there is a plastic-to-plastic bond between the thermoplastic overmold and the non-conductive carrier body. Other embodiments, aspects and features are also disclosed.
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Ganti, Kalyana Bhargava. 2012-07-17. Sealed substrate carrier for electroplating. https://www.osti.gov/biblio/1068864
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