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DOE OSTI · 1083459

Rapid thermal processing by stamping

Stradins, Pauls·Wang, Qi
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Abstract

A rapid thermal processing device and methods are provided for thermal processing of samples such as semiconductor wafers. The device has components including a stamp (35) having a stamping surface and a heater or cooler (40) to bring it to a selected processing temperature, a sample holder (20) for holding a sample (10) in position for intimate contact with the stamping surface; and positioning components (25) for moving the stamping surface and the stamp (35) in and away from intimate, substantially non-pressured contact. Methods for using and making such devices are also provided. These devices and methods allow inexpensive, efficient, easily controllable thermal processing.

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BibTeXRIS

Stradins, Pauls, Wang, Qi. 2013-03-05. Rapid thermal processing by stamping. https://www.osti.gov/biblio/1083459

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