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DOE OSTI · 1107804

Wafer-level packaging with compression-controlled seal ring bonding

Farino, Anthony J
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Abstract

A device may be provided in a sealed package by aligning a seal ring provided on a first surface of a first semiconductor wafer in opposing relationship with a seal ring that is provided on a second surface of a second semiconductor wafer and surrounds a portion of the second wafer that contains the device. Forcible movement of the first and second wafer surfaces toward one another compresses the first and second seal rings against one another. A physical barrier against the movement, other than the first and second seal rings, is provided between the first and second wafer surfaces.

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BibTeXRIS

Farino, Anthony J. 2013-11-05. Wafer-level packaging with compression-controlled seal ring bonding. https://www.osti.gov/biblio/1107804

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