DOE OSTI · 1123902
FleX-3D Wafer Processing for Chip Stacking and Interconnect
Abstract
The source did not provide an abstract. Follow the original record for more information.
Explore related subjects
Keep this discovery
Explore connections, maps & timelines
Wilson, Dale G.. 2014-03-20. FleX-3D Wafer Processing for Chip Stacking and Interconnect. https://www.osti.gov/biblio/1123902
Cite the original work for its findings. Save a collection to share your selection of sources.