DOE OSTI · 1374802
Power Electronics Thermal Management
Abstract
Thermal modeling was conducted to evaluate and develop thermal management strategies for high-temperature wide-bandgap (WBG)-based power electronics systems. WBG device temperatures of 175 degrees C to 250 degrees C were modeled under various under-hood temperature environments. Modeling result were used to identify the most effective capacitor cooling strategies under high device temperature conditions.
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Moreno, Gilberto (ORCID:0000000335654242). 2017-08-07. Power Electronics Thermal Management. https://www.osti.gov/biblio/1374802
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