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Special Section on InterPACK 2017—Part 1

Mysore, Kaushik·Narumanchi, Sreekant·Dede, Ercan·Khiabani, Reza
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Abstract

InterPACK is a premier international forum for exchange of state-of-the-art knowledge in research, development, manufacturing, and applications of micro-electronics packaging. It is the flagship conference of the ASME Electronic and Photonic Packaging Division (EPPD) founded in 1992 as an ASME-JSME joint biannual conference. Rapid changes in the semiconductor landscape together with findings from InterPACK Pathfinding workshop (IPW) in 2016 led to a significant reset of InterPACK conference priorities and focus to comprehensively address needs of the InterPACK community. As a result, starting in 2017, InterPACK has become an annual conference and the scope of the conference has increased significantly together with a systems-focus to include some of the most cutting-edge topics in electronics packaging, device integration, and reliability. These topics are organized across five different tracks: (1) heterogeneous integration: microsystems with diverse functionality, (2) servers of the future, (3) structural and physical health monitoring, (4) energy conversion and storage, and (5) transportation: autonomous and electric vehicles.

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3D-printing71 CLASSICAL AND QUANTUM MECHANICS, GENERAL PHYSICSadvanced interconnect technologiesautomotive electronics reliability sensorsdata center cooling technologiesmicroscale heat transfer

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Mysore, Kaushik, Narumanchi, Sreekant, Dede, Ercan, Khiabani, Reza. 2018-03-02. Special Section on InterPACK 2017—Part 1. https://doi.org/10.1115/1.4039090

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