MagMicro with Ultra-High Energy Resolution (FY19 Q3 Progress Report)

Abstract

The fabrication of the MMC detector arrays involves two photolithographic procedures. The first is to fabricate the Nb magnetization coil and pick-up coils, the SQUID preamplifiers and the associated wiring. This is done on a full 4” Si wafer, which is subsequently diced into ~0.5 cm2 SQUID chips and ~1 cm2 detector chips. The detector chips are then processed separately by depositing and patterning the paramagnetic Ag:Er sensor and support structures and then electroplating the Au absorber. In Q3, we have successfully completed the full wafer processing for the 32-pixel MMC detector arrays, diced the 4” wafer into the smaller chips and tested the individual components. The coils have the required critical current, the heat switches have a critical temperature in the desired range, and the SQUIDs have the required low noise. Unfortunately, the sputter deposition of the paramagnetic Ag:Er sensor failed several times. We spent considerable time to trace the problem to contaminations of the purifier for the Ar sputtering gas that had been exposed to atmosphere for an extended time during an earlier clean room upgrade. We then determined that the purifier is not essential for high-quality Ag:Er sensor films (Fig. 1), and successfully deposited the Ag:Er sensor film on the ~1 cm 2 detector chip.