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DOE OSTI · 1558357

Advanced Power Electronics Designs - Reliability and Prognostics

DeVoto, Douglas J
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Abstract

The electrical interconnection and isolation design aspects within an inverter must also provide high thermal performance and thermomechanical reliability. In collaboration with ORNL, DuPont, and Indiana Integrated Circuits (IIC), NREL is evaluating new packaging materials and manufacturing techniques for wide-bandgap-based traction inverters. Thermal modeling and experimental evaluation revealed that an organic direct-bond-copper (ODBC) substrate has similar thermal resistance to traditional ceramic substrates. High-temperature thermal cycling has shown the ODBC substrates to have greater reliability than ceramic substrates which is a significant finding in the quest for low-cost, power-dense, high-temperature power electronics. IIC's direct chip-to-chip topside electrical connection will be attached to ODBC substrates and reliability evaluation for both technologies will be performed at NREL in Q4.

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30 DIRECT ENERGY CONVERSION33 ADVANCED PROPULSION SYSTEMSelectrical interconnectionpower electronicsreliabilitythermal modelingtraction inverterwide bandgap

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DeVoto, Douglas J. 2019-08-15. Advanced Power Electronics Designs - Reliability and Prognostics. https://www.osti.gov/biblio/1558357

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