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DOE OSTI · 1600300

Thickness mapping using multispectral imaging

Rupnowski, Przemyslaw·Ulsh, Michael Joseph
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Abstract

An example system includes a material transport system configured to transport a substantially planar material through a monitoring zone, an illumination source configured to illuminate at least a portion of the material that is within the monitoring zone with light, and a sensor configured to obtain a plurality of consecutive datasets. Datasets indicate, for locations of the material and for a specific wavelength of light, a respective intensity of the light that is of the wavelength and that is received from the location. The system also includes a processing system configured to receive the dataset, determine, based on the dataset and for each of at least two locations in the plurality of locations, a respective value of a thickness of the material, and execute, based on the respective value of the thickness of the material for at least one of the at least two locations, an action.

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BibTeXRIS

Rupnowski, Przemyslaw, Ulsh, Michael Joseph. 2019-11-19. Thickness mapping using multispectral imaging. https://www.osti.gov/biblio/1600300

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