JEDEC Tray Flexures for High-Consequence Electronics

Abstract

JEDEC matrix trays are an industry standard for the safe handling, transport, and storage of electronics. Manufacturing tolerances of the trays (typical for injection-molded components) forces the creation of an envelope around components rather than a secure interface to prevent the trays themselves from damaging the electronics during use. However, this allows relative motion between the components, another potential damage source. This paper covers the design of tray features (flexures) than enable intentional, tuned contact preload to prevent relative motion, maximizing component safety while keeping the JEDEC tray form-factor. The target preload is balanced between gravity and shipment forces that could be experience during adverse handling or transport to prevent loss of contact or slip and keeping the load itself low enough to prevent component damage. Typical features/dimensions for JECEC trays were employed to maximize utility and minimize tray fabrication difficulty. The design also increases usability and component safety by making the chips visible while still sandwiched between trays. The point design described here exemplifies a simple, easy-to-manufacture tray-matrix flexure that significantly improves the security of supported components