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DOE OSTI · 1669475

Advanced Power Electronics Designs - Reliability and Prognostics (Keystone Project 1)

DeVoto, Douglas (ORCID:0000000348179647)
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Abstract

The primary deliverable for this project will be to construct a power electronics package utilizing an organic electrically insulating substrate material with a direct chip-to-chip interconnect technology and demonstrate superior thermal performance and greater reliability under thermal cycling, thermal aging, vibration, power cycling, and electrical high-potential evaluation over traditional packages.

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47 OTHER INSTRUMENTATIONinterconnectspackagingpower electronicsreliabilitysubstrates

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BibTeXRIS

DeVoto, Douglas (ORCID:0000000348179647). 2020-06-08. Advanced Power Electronics Designs - Reliability and Prognostics (Keystone Project 1). https://www.osti.gov/biblio/1669475

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