DOE OSTI · 1676596
Materials Data on U6Cu3Ni3Sb8 by Materials Project
Abstract
U6Ni3Cu3Sb8 crystallizes in the monoclinic C2 space group. The structure is three-dimensional. there are four inequivalent U3+ sites. In the first U3+ site, U3+ is bonded in a 8-coordinate geometry to eight Sb3- atoms. There are a spread of U–Sb bond distances ranging from 3.24–3.35 Å. In the second U3+ site, U3+ is bonded in a 8-coordinate geometry to eight Sb3- atoms. There are a spread of U–Sb bond distances ranging from 3.22–3.35 Å. In the third U3+ site, U3+ is bonded in a 8-coordinate geometry to eight Sb3- atoms. There are a spread of U–Sb bond distances ranging from 3.23–3.35 Å. In the fourth U3+ site, U3+ is bonded in a 8-coordinate geometry to eight Sb3- atoms. There are a spread of U–Sb bond distances ranging from 3.24–3.34 Å. There are two inequivalent Ni1+ sites. In the first Ni1+ site, Ni1+ is bonded in a 4-coordinate geometry to four Sb3- atoms. There are two shorter (2.64 Å) and two longer (2.65 Å) Ni–Sb bond lengths. In the second Ni1+ site, Ni1+ is bonded in a 4-coordinate geometry to four Sb3- atoms. There are two shorter (2.65 Å) and two longer (2.66 Å) Ni–Sb bond lengths. There are two inequivalent Cu1+ sites. In the first Cu1+ site, Cu1+ is bonded in a 4-coordinate geometry to four Sb3- atoms. All Cu–Sb bond lengths are 2.66 Å. In the second Cu1+ site, Cu1+ is bonded in a 4-coordinate geometry to four Sb3- atoms. There are one shorter (2.66 Å) and three longer (2.67 Å) Cu–Sb bond lengths. There are four inequivalent Sb3- sites. In the first Sb3- site, Sb3- is bonded in a 9-coordinate geometry to six U3+, one Ni1+, and two Cu1+ atoms. In the second Sb3- site, Sb3- is bonded in a 9-coordinate geometry to six U3+, two Ni1+, and one Cu1+ atom. In the third Sb3- site, Sb3- is bonded in a 9-coordinate geometry to six U3+, one Ni1+, and two Cu1+ atoms. In the fourth Sb3- site, Sb3- is bonded in a 9-coordinate geometry to six U3+, two Ni1+, and one Cu1+ atom.
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2020-05-02. Materials Data on U6Cu3Ni3Sb8 by Materials Project. https://doi.org/10.17188/1676596
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