DOE OSTI · 1735123
Reversibly bonded devices and methods of making and using the same
Abstract
The present disclosure concerns embodiments of reversibly bonded devices that comprise a reversible bonding component. The reversible bonding component is able to exhibit strong adhesive properties so as to couple device components, but upon exposure to an energy source, the strong adhesive properties are weakened. By weakening the adhesive strength of the reversible bonding component, the device can be deconstructed to access internal biological samples for analysis and characterization.
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Nath, Pulak, Huang, Jen-Huang. 2020-08-11. Reversibly bonded devices and methods of making and using the same. https://www.osti.gov/biblio/1735123
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