Shock recompaction of spall damage

Abstract

Spall fracture is a high strain-rate damage phenomenon associated with shock or impulsive loading events. When a material that has been subjected to shock compression is allowed to release, rarefaction waves propagate into the sample and reduce the internal stress to zero. If multiple rarefaction waves intersect, they generate tension which, if sufficient, can nucleate voids in the material. It has been observed in several works investigating spall fracture that although the shock-wave profiles suggested spall occurred, imaging of the recovered sample revealed no voids or cracks. In this study, we aim to determine whether a second shock event could recompact existing spall damage, and if so, what form does the microstructure at the recompaction interface have? Through a series of gas-gun flyer-plate impact experiments, we demonstrate that modest shock stresses of 2 GPa–3 GPa are enough to both fully compact a damaged copper target back to a state of zero porosity and, furthermore, drive recrystallization of the interface such that there is a new bond formed where the free surfaces were brought together.