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DOE OSTI · 1821712

Ultrasonic Thermometer Sticking Mitigation Assessment

Daw, Joshua E.
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Abstract

Ultrasonic thermometers have potential to improve on current technologies for very high temperature measurements. One issue limiting their adoption is the formation of diffusion bonds between the acoustic waveguide used as the sensor, and its surroundings (in some cases, a protective sheath). Several potential methods for reducing this diffusion bonding (known as sticking) have been identified. Prototype ultrasonic thermometers were fabricated and tested to high temperatures in order to evaluate these methods. Several showed promise for low temperature use. The most promising option was 3-D printed ceramic spacers.

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Daw, Joshua E.. 2021-08-01. Ultrasonic Thermometer Sticking Mitigation Assessment. https://doi.org/10.2172/1821712

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