DOE OSTI · 1859918
Runtime localized cooling of high-performance processors
Abstract
A plurality of thermal electric cooler (TEC) elements are formed in a TEC grid structure. Control logic dynamically varies a supply current supplied to each TEC element (or group of TEC elements) in the TEC grid based on changes in power density respectively associated with areas cooled by each of the TEC elements or group of TEC elements.
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Rao, Karthik, Huang, Wei, An, Xudong, Arora, Manish, Greathouse, Joseph L.. 2021-10-05. Runtime localized cooling of high-performance processors. https://www.osti.gov/biblio/1859918
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