Microfabricated Devices and Ion Trapping Capabilities

Abstract

Next generation ion traps will likely need to support tens if not hundreds of ions in order to achieve several logical qubits. As we scale to those sizes, the same problems we face now – rf dissipation, control I/O, and optical access – will only grow and become more complicated. While many of these challenges can potentially be solved with technology integration, independently researching the feasibility of that integration and other solutions may help reduce the time and risk in scaling up to larger traps, by testing on smaller less complex devices. We should also consider other fabrication techniques that may help scale to larger devices, such as: through-substrate-vias (TSVs), different metal coatings, exotic rf routing, on chip laser sources, or even a secondary macroscopic trap to reload ions from. To have these technologies ready for full scale integration when we need them, ion traps with some of these capabilities need to be produced now. Developing the rigorous fabrication methods for producing reliable traps takes time and experimentation. We propose developing larger ion traps and reliable integrated technology in conjunction to make both available faster.