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DOE OSTI · 1892728

Non-permeable substrate carrier for electroplating

Abas, Emmanuel Chua·Chen, Chen-An·Ma, Diana Xiaobing·Ganti, Kalyana Bhargava·Divino, Edmundo Anida·Ermita, Jake Randal G.·Capulong, Jose Francisco S.·Castillo, Arnold Villamor
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Abstract

One embodiment relates to a substrate carrier for use in electroplating a plurality of substrates. The substrate carrier comprises a non-conductive carrier body on which the substrates are to be held. Electrically-conductive lines are embedded within the carrier body, and a plurality of contact clips are coupled to the electrically-conductive lines embedded within the carrier body. The contact clips hold the substrates in place and electrically couple the substrates to the electrically-conductive lines. The non-conductive carrier body is continuous so as to be impermeable to flow of electroplating solution through the non-conductive carrier body. Other embodiments, aspects and features are also disclosed.

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BibTeXRIS

Abas, Emmanuel Chua, Chen, Chen-An, Ma, Diana Xiaobing, Ganti, Kalyana Bhargava, Divino, Edmundo Anida, Ermita, Jake Randal G., Capulong, Jose Francisco S., Castillo, Arnold Villamor. 2022-03-22. Non-permeable substrate carrier for electroplating. https://www.osti.gov/biblio/1892728

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