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DOE OSTI · 1963713

Sound Assisted Low Temperature Spalling: Upscaling and Throughput

Bertoni, Mariana
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Abstract

In evaluating the state-of-the-art spalling techniques, the key factor that is missing is the control of crack propagation, which is responsible for low quality wafers due to high surface roughness and Total Thickness Variation, TTV. This project has shown that acoustic waves can alter the conditions at the crack tip during thermal spalling, modifying the propagation speed and the stress field around it (stress intensity factor, K). Both factors are directly related to the roughness of the spalled surface, so as we control speed and stress, we can fine-tune the surface roughness through the entire wafer as suggested by Arakawa.

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Bertoni, Mariana. 2023-03-15. Sound Assisted Low Temperature Spalling: Upscaling and Throughput. https://doi.org/10.2172/1963713

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